Composite analysis (Option)

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Composite analysis (Option)

The composite of interlayer resin or solder resist is analyzed.

Presence of filler additive is seen. This enhances tensile strength and  flame resistance.

There are a several analysis methods.

The typical analysis methods are:

         Resin analysis                : FT-IR

         Additive (Filer) analysis  : EDX

           Linear expansion coefficient of resin : Thermal Mechanism Analysis (TMA)

・Example of a substrate resin analysis by FT-IR

・Examples of the solder resist material analysis

・Examples of coefficient of thermal expansion analysis

Measurement of the coefficient of thermal expansion of the PCB.