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Composite analysis (Option)

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 PCB Reverse Engineering

Composite analysis (Option)

The composite of interlayer resin or solder resist is analyzed.

Presence of filler additive is seen. This enhances tensile strength and  flame resistance.

There are a several analysis methods.

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The typical analysis methods are:

         Resin analysis                : FT-IR

         Additive (Filer) analysis  : EDX

           Linear expansion coefficient of resin : Thermal Mechanism Analysis (TMA)

・Example of a substrate resin analysis by FT-IR

・Examples of the solder resist material analysis

・Examples of coefficient of thermal expansion analysis

Measurement of the coefficient of thermal expansion of the PCB.

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