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Composite analysis (Option)
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Composite analysis (Option)
The composite of interlayer resin or solder resist is analyzed.
Presence of filler additive is seen. This enhances tensile strength and flame resistance.
There are a several analysis methods.
The typical analysis methods are:
Resin analysis : FT-IR
Additive (Filer) analysis : EDX
Linear expansion coefficient of resin : Thermal Mechanism Analysis (TMA)
・Example of a substrate resin analysis by FT-IR



・Examples of the solder resist material analysis


・Examples of coefficient of thermal expansion analysis
Measurement of the coefficient of thermal expansion of the PCB.

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