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Analysis Menu
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Layer Images
Extract layout data by delayering each layer
Each layer image is included in standard reports
LTEC Corporation has extensive experience in the analysis of high power PCBs ( Automotive), high-density PCBs (Smartphones, wearables), high frequency ceramic boards (Communication), and complex 3D packages.
LTEC offers various CAD data formats such Gerber, DXF, OrCAD, MCM, and others.
Cross section by X-ray
It is found that no. of layers are four and each layer are connected by through hole.
The delayering process is conducted by special technique based on this information
