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Analysis Menu

Layer Images

Extract layout data by delayering each layer

Each layer image is included in standard reports


LTEC Corporation has extensive experience in the analysis of high power PCBs ( Automotive), high-density PCBs (Smartphones, wearables),  high frequency ceramic boards (Communication), and complex 3D packages.

LTEC offers various CAD data formats such Gerber, DXF, OrCAD, MCM, and others.

Cross section by X-ray

It is found that no. of layers are four and each layer are connected by through hole.

The delayering process is conducted by special technique based on this information

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