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Verification of package pin to die pad connection for circuit analysis has been conventionally performed by X-ray imaging; however, within modules and multilayer PCBs, metal interconnect tracing by X-ray analysis is not practical. Therefore, use of delayering, layer by layer digitization followed by automatic, semiautomatic or manual circuit tracing is indispensable.
Through layer-by-layer deconstruction of the module and the multi-layer PCB, the internal connections, design rules, and internal system details are revealed.
Planar layout and design rule analysis by delayering n FPGA module
Actual results for a variety of modules ( FC-BGA, LTCC, PCBs) are shown.
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