For Micro Electro Mechanical Systems (MEMS), the driving circuit, and the MEMS cavity are sometimes formed within the semiconductor die. In other cases, the cavity is at the surface of the die. To perform the MEMS structural analysis, the package needs to be opened without damaging the MEMS structure.
A variety of accelerometer sensors, gyro sensors, Si Microphones, pressure sensors are shown including DMD (Digital Micromirror Device), etc.
Structural analysis (film thickness, pitch, etc.) of the driver, evaluation of sealing portion, verification of the connection of the terminals
and the driver unit, etc. are included.