1. PCB, package structural analysis

   ・ Internal structure verification by X-ray

   ・ Planar layout and design rules analysis

   ・ Cross-sectional structural analysis

   ・Material composition analysis, etc.

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2. IC die structural analysis

   ・Die layer structural analysis,

   ・Circuit components (transistors, resistors,  capacitors, etc.) structural analysis

   ・Visualization of the Si substrate structure (diffusion layers)

   ・Manufacturing process flow estimation 

 

3.Product

   ・Semiconductor products: Logic, Analog, LCD drivers, Tag-IC, Power devices, etc.

   ・Compound semiconductor products: LEDs, Power Amplifiers (Modules), etc.

   ・Piezoelectric devices: SAW filters, Duplexers, etc.

   ・LCD panels: Organic EL, MEMS, etc.