Semiconductor ICs are changing from single-device/single-function structure to embedded multi-functional System-on-Chip (SoC), and System-in-Package (SiP). The integration of MEMS sensors with conventional CMOS technology is another trend. Advanced panel displays are incorporating the control and driver circuitry within the panel. 3D packaging technology is used to integrate complex functions at system level, leading to a concentration of sophisticated design know-how and associated Intellectual Property (IP), all within the 3D package. Operation analysis, device structural and circuit analysis are routinely performed in all of these systems. LTEC Corporation’s career analysts are ready to support their customers engaged in new product research and development, and offer their assistance in protecting intellectual property.